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Packaging engineer • ottawa on
- Promoted
Microelectronic Packaging Design Engineer - (80148)
SanminaOttawa, ON, CanadaAdvanced Packaging Engineer
RANOVUSOttawa, Ontario- Promoted
Software Engineer - packaging - optimize Ubuntu Server
CanonicalOttawa, ON, Canada- Promoted
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The Six SemiconductorOntario, Canada, Canada- Promoted
Memory Layout Engineer
HCLTechOttawa, ON, Canada- Promoted
Microelectronic Packaging Design Engineer
New England Design & ConstructionOttawa, ON, Canada- Promoted
Microelectronic Packaging Design Engineer
Global Talent Alliance, CanadaOttawa, ON, Canada- Promoted
Printing and Packaging Sales Representative
NewprintOttawa, ON, Canada- Promoted
Engineering Technician – Hermetic Packaging & Integration
LumentumOttawa, ON, Canada- Promoted
MECHANICAL ENGINEER
RanovusOttawa, ON, Canada- Promoted
Optical Engineer
AI-SPECTRAL TECHNOLOGY CORP.Ottawa, ON, Canada- Promoted
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Sanmina-SCI Systems de MéxicoOttawa, ON, Canada- Promoted
Ingénieur senior en conception de circuits intégrés à signaux analogiques / mixtes - Acacia
CiscoOttawa, ON, Canada- Promoted
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Lumentum Operations LLCOttawa, ON, Canada- Promoted
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LIV Design Collective LLCOttawa, ON, Canada- Promoted
Analog Engineer
CienaOttawa, ON, CanadaSystem Administrator - Linux
Altis TechnologyOttawa, ON, United StatesMaterial Handler - Packaging
AdeccoOttawa, Ontario- Promoted
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Hard Rock Hotel & Casino OttawaOttawa, ON, Canada- North York, ON (from $ 47,098 to $ 173,903 year)
- East York, ON (from $ 47,098 to $ 173,903 year)
- Markham, ON (from $ 47,098 to $ 173,903 year)
- Cambridge, ON (from $ 120,388 to $ 166,558 year)
- Mississauga, ON (from $ 112,500 to $ 155,373 year)
- Calgary, AB (from $ 101,515 to $ 149,916 year)
- Old toronto, ON (from $ 85,000 to $ 147,680 year)
- Toronto, ON (from $ 82,236 to $ 147,447 year)
- Ottawa, ON (from $ 123,000 to $ 145,382 year)
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Microelectronic Packaging Design Engineer - (80148)
SanminaOttawa, ON, Canada- Full-time
Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq : SANM), responsible for RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and testing, process development, assembly and test innovation, to volume manufacturing. We are extremely proud to partner with our customers enabling their product through the full product lifecycle.
At AMT, you will work on some of the most innovative programs and products that address emerging markets, including optical and RF communication, datacenter connectivity, quantum computing, automotive sensing systems, medical devices and diagnostics and test & measurement systems, to name a few.
Come and join us, and be part of a team that challenges you to be your best, where you will be empowered to make a difference and where we are extremely proud of what we deliver, together.
Job Purpose
The Microelectronic Design Engineering team, as part of Sanmina’s Global Design Engineering Team, represents one of the key strategic growth areas of the total engineering service offering. Our team provides engineering and design services in microelectronic, optical and semiconductor packaging and component design supported through its in depth background in materials technology, thermal, structural and reliability engineering.
We are seeking a Microelectronic Packaging Design Engineer to join our team and support both technology and product development programs, from initial technology selection and concept definition through detailed design, prototyping, qualification and volume manufacturing phases.
Nature of Duties / Responsibilities :
- Selection and definition of microelectronic technologies and design concepts, based on product applications, requirements and specifications.
- Design of microelectronic modules, component and packages, including substrate layout and detailed designs integrating elements of material selections, mechanical and thermal design as well as incorporating key aspects of reliability, electrical (RF), optical, test and process engineering for volume manufacturing.
- Contribute to microelectronic design and engineering activities as part of a multidisciplinary product development team including electrical / RF engineering optical engineering, reliability engineering, layout, documentation, manufacturing / process engineering and test engineering, in line with customer requirements and specifications.
- Generate product documentation including design specifications, drawings (piece parts, assembly, process) Bill of Materials, documentation release by engineering change order (ECO).
- Define specifications / requirements and coordinate / interface with manufacturers / suppliers for outsourced custom components.
- Perform and support engineering product verification, ensuring compliance to product requirements.
- Support business development initiatives including interfacing with potential and existing customer, preparation of marketing materials, proposals and quotations.
- Support turnkey product development process through to manufacturing implementation.
Education and Experience :
Sanmina welcomes and encourages applications from persons with disabilities. In accordance with the guidelines established under the Accessibility for Ontarians with Disabilities Act (AODA), accommodations are available on request for candidates taking part in all aspects of the selection process.
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