Packaging engineer Jobs in Markham, ON

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THE ROLE:
We are looking for a forward-thinking candidate to drive the development and deployment of next-generation packaging design automation and AI-assisted workflows. You will focus on accelerating the design of advanced heterogeneous integration technologies, specifically substrates, organic interposers, and bridge interconnects. AMD's environment is fast-paced, results-oriented, and built upon a legion of innovators with a passion for winning technology.

THE PERSON:
The successful candidate must be a technical innovator who can bridge the gap between physical design requirements and software automation. He or she must have a drive for solutions and an aptitude to thrive in a multi-tasking environment, translating complex design challenges into scriptable, scalable workflows. They should possess excellent cross-functional collaboration skills to work between Design, EDA, and AI teams, with good executive presentation skills. Demonstrating strong technical leadership to excel in his/her work with minimum supervision and a strong interest in growing within the technical or management ladder.

KEY RESPONSIBILITIES:

• Drive the development and maintenance of automation scripts and tools for Substrate, Interposer, and Silicon Bridge design flows.
• Deploy AI/ML methodologies to optimize critical design stages, including auto-routing, component placement, and signal integrity optimization.
• Collaborate with EDA vendors and internal stakeholders to define and implement next-generation feature roadmaps for 2.5D and 3D packaging.
• Lead the transition from manual design practices to "Agentic" and algorithmic design operational models.
• Coordinate with electrical and mechanical analysis teams to build closed-loop optimization systems that feed simulation results back into design construction.
• Prepare & present Executive Summaries of automation ROI, efficiency gains, and tool capability advancements.
• Coordination of activities within/external teams to deliver critical design tape-outs and methodology milestones.
• Mentoring junior engineers in coding best practices and advanced packaging concepts.

PREFERRED EXPERIENCE:

• Strong knowledge of EDA packaging design tools (Cadence APD/SIP, Siemens Xpedition, or Synopsys 3DIC/Compiler).
• Proven track record of developing automation using Python, Tcl, SKILL, or C++.
• Experience with applying AI/ML frameworks (PyTorch, TensorFlow, etc.) to engineering or design problems.
• Familiarity with Advanced Packaging architectures (2.5D/3D, Chiplets, Fan-Out, Hybrid Bonding).
• Familiar with design verification flows (DRC/LVS) and electrical extraction concepts.
• Good leadership and interpersonal skills.

ACADEMIC CREDENTIALS:

• Bachelor/MS degree in Electrical Engineering, Computer Engineering, Computer Science, or related field with relevant packaging experience.

#LI-HYBRID

#LI-AP1

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

THE ROLE:
We are looking for a forward-thinking candidate to drive the development and deployment of next-generation packaging design automation and AI-assisted workflows. You will focus on accelerating the design of advanced heterogeneous integration technologies, specifically substrates, organic interposers, and bridge interconnects. AMD's environment is fast-paced, results-oriented, and built upon a legion of innovators with a passion for winning technology.

THE PERSON:
The successful candidate must be a technical innovator who can bridge the gap between physical design requirements and software automation. He or she must have a drive for solutions and an aptitude to thrive in a multi-tasking environment, translating complex design challenges into scriptable, scalable workflows. They should possess excellent cross-functional collaboration skills to work between Design, EDA, and AI teams, with good executive presentation skills. Demonstrating strong technical leadership to excel in his/her work with minimum supervision and a strong interest in growing within the technical or management ladder.

KEY RESPONSIBILITIES:

• Drive the development and maintenance of automation scripts and tools for Substrate, Interposer, and Silicon Bridge design flows.
• Deploy AI/ML methodologies to optimize critical design stages, including auto-routing, component placement, and signal integrity optimization.
• Collaborate with EDA vendors and internal stakeholders to define and implement next-generation feature roadmaps for 2.5D and 3D packaging.
• Lead the transition from manual design practices to "Agentic" and algorithmic design operational models.
• Coordinate with electrical and mechanical analysis teams to build closed-loop optimization systems that feed simulation results back into design construction.
• Prepare & present Executive Summaries of automation ROI, efficiency gains, and tool capability advancements.
• Coordination of activities within/external teams to deliver critical design tape-outs and methodology milestones.
• Mentoring junior engineers in coding best practices and advanced packaging concepts.

PREFERRED EXPERIENCE:

• Strong knowledge of EDA packaging design tools (Cadence APD/SIP, Siemens Xpedition, or Synopsys 3DIC/Compiler).
• Proven track record of developing automation using Python, Tcl, SKILL, or C++.
• Experience with applying AI/ML frameworks (PyTorch, TensorFlow, etc.) to engineering or design problems.
• Familiarity with Advanced Packaging architectures (2.5D/3D, Chiplets, Fan-Out, Hybrid Bonding).
• Familiar with design verification flows (DRC/LVS) and electrical extraction concepts.
• Good leadership and interpersonal skills.

ACADEMIC CREDENTIALS:

• Bachelor/MS degree in Electrical Engineering, Computer Engineering, Computer Science, or related field with relevant packaging experience.

#LI-HYBRID

#LI-AP1

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.