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Packaging engineer Offres d'emploi - Markham, ON

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Packaging engineer • markham on

Dernière mise à jour : il y a 6 jours

Packaging Automation Engineer

Advanced Micro Devices, IncMARKHAM, Ontario, Canada
Temps plein

WHAT YOU DO AT AMD CHANGES EVERYTHING.At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded syst...Voir plus

Thermal Engineer

Amphenol HSIOMarkham, ON, CA
Temps plein

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets.A...Voir plus

Lead Electrical Engineer

AmerescoRichmond Hill,Ontario,Canada
Temps plein

NYSE:AMRC) is a leading energy solutions provider dedicated to helping customers reduce costs, enhance resilience, and decarbonize to net zero in the global energy transition.We are a trusted, full...Voir plus

Senior Packaging / Mechanical Engineer

Crystal Claire Cosmetics IncMarkham, ON
Temps plein

Only those selected for an interview will be contacted, and applicants who do not receive a response within a reasonable timeframe may assume their application was unsuccessful.We sincerely thank a...Voir plus

AI Engineer

BDOMarkham
Temps plein

Putting people first, every day.BDO is a firm built on a foundation of positive relationships with our people and our clients.Each day, our professionals provide exceptional service, helping client...Voir plus

Applications Engineer

MTS RecruitingScarborough, Ontario
Temps plein +1

Our client, a leading manufacturer in advanced engineered products, is seeking an.This role focuses on engineering deliverables, technical communication, and cross-functional collaboration througho...Voir plus

Transmission Line Engineer

StantecMarkham, ON
Temps plein +1

At Stantec, we know the work we do matters.From decarbonizing mines to modernizing electric grids and building the infrastructure that fuels communities, we’re powering the world.Our clients come t...Voir plus

Manufacturing Engineer

MTS RecruitingRichmond Hill, ON
Permanent

Our client is an established manufacturer of pipe products.They are looking for a Manufacturing Engineer to join them at their Brampton location.The Manufacturing Engineer is responsible for drivin...Voir plus

SCADA Project Engineer

RRC CompaniesRichmond Hill, Canada
Temps plein

ESSENTIAL DUTIES AND RESPONSIBILITIES.Manage and maintain project schedules, deliverables, and submittal requirements while working closely with the project management and engineering teams.Coordin...Voir plus

Mechanical Engineer

Inviro Engineered SystemsScarborough, ON, CA
Temps plein
Quick Apply

Mechanical Engineer Full Time Are you a motivated and passionate individual, eager to advance your career?.As one of Canada’s leading Mechanical/Electrical engineering firms, INVIRO is looking for ...Voir plus

Test Bay Engineer

Amaris ConsultingMarkham, Canada
Temps plein

Generator Protection, Generator Excitation, Transformer Protection, Feeder Protection, Bus Protection, and Line Protection Systems.This role ensures that multi-function relays and associated contro...Voir plus

Design engineer, electrical

trans-tec incScarborough, ON, Canada
Permanent

Are you authorized to work in Canada?.Do you have experience working in this field?.Involves duties and responsibilities that lead to positive environmental outcomes.Heures de travail: 40 hours per...Voir plus

Panel Assembler - Days - Scarborough

NPA WorldWideScarborough, Ontario, Canada
Temps plein +1

Monday to Friday - 6:00am to 2:30pm.Layout and perform electrical wiring of industrial control panels.Interpret schematics, wiring diagrams, panel layouts, and assembly drawings as applicable to th...Voir plus

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Mechanical Engineer

AECOMThornhill, CAN
Temps plein

At AECOM, we're delivering a better world.Whether improving your commute, keeping the lights on, providing access to clean water, or transforming skylines, our work helps people and communities thr...Voir plus

Manufacturing Engineer

Adecco CanadaScarborough, Ontario, Canada
Temps plein +1
Quick Apply

Adecco is currently hiring a full-time Manufacturing Engineer to manage production master files, release plans, and ensure accurate BOMs to support efficient manufacturing and procurement for our c...Voir plus

Refining Engineer

Randstad CanadaMarkham, Ontario, CA
Permanent
Quick Apply

Are you a results-oriented Chemical Engineer or Chemist ready to take on a challenging, hands-on role in a critical production environment? We are seeking a dedicated Process Engineer (Chemical Ref...Voir plus

Engineer - AI-Driven Software & Automation Engineer

Huawei Technologies Canada Co., Ltd.Markham, Ontario, CA
Temporaire

Huawei Canada has an immediate 12-month contract opening for an Engineer.From Procurement to Finance to IT services and much more, the Quality & Operation Department provides critical support for a...Voir plus

Mechanical Design Engineer

ABI Auto-Bake Industries Ltd.Richmond Hill, ON, CA
Temps plein

Since 1989, ABI has been at the forefront of developing cutting-edge technology that transforms how bakeries produce high-quality food at scale.As a global integrator of automated bakery equipment,...Voir plus

Packaging Automation Engineer

Packaging Automation Engineer

Advanced Micro Devices, IncMARKHAM, Ontario, Canada
Il y a plus de 30 jours
Type de contrat
  • Temps plein
Description de poste

WHAT YOU DO AT AMD CHANGES EVERYTHING

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.Together, we advance your career.

THE ROLE:
We are looking for a forward-thinking candidate to drive the development and deployment of next-generation packaging design automation and AI-assisted workflows. You will focus on accelerating the design of advanced heterogeneous integration technologies, specifically substrates, organic interposers, and bridge interconnects. AMD's environment is fast-paced, results-oriented, and built upon a legion of innovators with a passion for winning technology.

THE PERSON:
The successful candidate must be a technical innovator who can bridge the gap between physical design requirements and software automation. He or she must have a drive for solutions and an aptitude to thrive in a multi-tasking environment, translating complex design challenges into scriptable, scalable workflows. They should possess excellent cross-functional collaboration skills to work between Design, EDA, and AI teams, with good executive presentation skills. Demonstrating strong technical leadership to excel in his/her work with minimum supervision and a strong interest in growing within the technical or management ladder.

KEY RESPONSIBILITIES:

  • Drive the development and maintenance of automation scripts and tools for Substrate, Interposer, and Silicon Bridge design flows.
  • Deploy AI/ML methodologies to optimize critical design stages, including auto-routing, component placement, and signal integrity optimization.
  • Collaborate with EDA vendors and internal stakeholders to define and implement next-generation feature roadmaps for 2.5D and 3D packaging.
  • Lead the transition from manual design practices to "Agentic" and algorithmic design operational models.
  • Coordinate with electrical and mechanical analysis teams to build closed-loop optimization systems that feed simulation results back into design construction.
  • Prepare & present Executive Summaries of automation ROI, efficiency gains, and tool capability advancements.
  • Coordination of activities within/external teams to deliver critical design tape-outs and methodology milestones.
  • Mentoring junior engineers in coding best practices and advanced packaging concepts.

PREFERRED EXPERIENCE:

  • Strong knowledge of EDA packaging design tools (Cadence APD/SIP, Siemens Xpedition, or Synopsys 3DIC/Compiler).
  • Proven track record of developing automation using Python, Tcl, SKILL, or C++.
  • Experience with applying AI/ML frameworks (PyTorch, TensorFlow, etc.) to engineering or design problems.
  • Familiarity with Advanced Packaging architectures (2.5D/3D, Chiplets, Fan-Out, Hybrid Bonding).
  • Familiar with design verification flows (DRC/LVS) and electrical extraction concepts.
  • Good leadership and interpersonal skills.

ACADEMIC CREDENTIALS:

  • Bachelor/MS degree in Electrical Engineering, Computer Engineering, Computer Science, or related field with relevant packaging experience.

#LI-HYBRID

#LI-AP1

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

THE ROLE:
We are looking for a forward-thinking candidate to drive the development and deployment of next-generation packaging design automation and AI-assisted workflows. You will focus on accelerating the design of advanced heterogeneous integration technologies, specifically substrates, organic interposers, and bridge interconnects. AMD's environment is fast-paced, results-oriented, and built upon a legion of innovators with a passion for winning technology.

THE PERSON:
The successful candidate must be a technical innovator who can bridge the gap between physical design requirements and software automation. He or she must have a drive for solutions and an aptitude to thrive in a multi-tasking environment, translating complex design challenges into scriptable, scalable workflows. They should possess excellent cross-functional collaboration skills to work between Design, EDA, and AI teams, with good executive presentation skills. Demonstrating strong technical leadership to excel in his/her work with minimum supervision and a strong interest in growing within the technical or management ladder.

KEY RESPONSIBILITIES:

  • Drive the development and maintenance of automation scripts and tools for Substrate, Interposer, and Silicon Bridge design flows.
  • Deploy AI/ML methodologies to optimize critical design stages, including auto-routing, component placement, and signal integrity optimization.
  • Collaborate with EDA vendors and internal stakeholders to define and implement next-generation feature roadmaps for 2.5D and 3D packaging.
  • Lead the transition from manual design practices to "Agentic" and algorithmic design operational models.
  • Coordinate with electrical and mechanical analysis teams to build closed-loop optimization systems that feed simulation results back into design construction.
  • Prepare & present Executive Summaries of automation ROI, efficiency gains, and tool capability advancements.
  • Coordination of activities within/external teams to deliver critical design tape-outs and methodology milestones.
  • Mentoring junior engineers in coding best practices and advanced packaging concepts.

PREFERRED EXPERIENCE:

  • Strong knowledge of EDA packaging design tools (Cadence APD/SIP, Siemens Xpedition, or Synopsys 3DIC/Compiler).
  • Proven track record of developing automation using Python, Tcl, SKILL, or C++.
  • Experience with applying AI/ML frameworks (PyTorch, TensorFlow, etc.) to engineering or design problems.
  • Familiarity with Advanced Packaging architectures (2.5D/3D, Chiplets, Fan-Out, Hybrid Bonding).
  • Familiar with design verification flows (DRC/LVS) and electrical extraction concepts.
  • Good leadership and interpersonal skills.

ACADEMIC CREDENTIALS:

  • Bachelor/MS degree in Electrical Engineering, Computer Engineering, Computer Science, or related field with relevant packaging experience.

#LI-HYBRID

#LI-AP1

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.