Senior Microelectronics Process Engineer

Advanced Microsystems Technologies (AMT) is a technology division of Sanmina Corporation (Nasdaq : SANM), responsible for RF, microelectronic, optical components and integrated subsystems, providing services from design concept through prototype design and testing, process development, assembly and test innovation, to volume manufacturing. We partner with customers to enable their product through the full product lifecycle.

At AMT, you will work on innovative programs addressing emerging markets, including optical and RF communication, datacenter connectivity, quantum computing, automotive sensing systems, medical devices and diagnostics, and test & measurement systems.

Come and join us, and be part of a team that challenges you to be your best, where you will be empowered to make a difference and where we are extremely proud of what we deliver, together.

Job Purpose

We are seeking an industry expert to lead the process architecture and development for our next-generation optical and microelectronic process solutions. In this pivotal role, you will act as the technical anchor for our product solutions team. You will not simply run processes; you will define the assembly strategy from the ground up. Bridging the gap between R&D and high-volume manufacturing, you will own the end-to-end process lifecycle—from initial concept and recipe development to equipment selection and final release-to-manufacturing. If you are a hands-on expert in flip-chip, wire bonding, and advanced optical packaging who thrives on solving complex device physics challenges, we want you to lead our technical vision.

Key Responsibilities

Process Architecture & Development

• Define the Strategy : Conceptualize and develop comprehensive assembly strategies for complex optoelectronic modules, ensuring alignment with device physics, thermal requirements, and throughput goals.
• Advanced Packaging Execution : Lead the hands-on development of critical process recipes, including Flip Chip, Underfill, Die Attach ( epoxy & eutectic AuSn ), and Wire Bonding (ball / wedge).
• Equipment Leadership : Research, specify, and procure capital equipment. Oversee acceptance testing (SAT / FAT) to ensure new capabilities meet technological roadmaps.

NPI & Design for Manufacturability (DFx)

Quality, Analysis & Control

Mentorship & Leadership

Required Experience & Education

Technical Skills

Preferred Assets

Why Join Us?

Other Information

Sanmina welcomes and encourages applications from persons with disabilities. In accordance with the guidelines established under the Accessibility for Ontarians with Disabilities Act (AODA), accommodations are available on request for candidates taking part in all aspects of the selection process.

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