Social networking, machine learning, and big data analytics demand ever-increasing network connectivity. RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation data center infrastructures. We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation. Working with world class fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber‑optic communications products for data‑centers.
Job Title
Advanced Packaging Engineer
Responsibilities
- Design and develop complex sub‑assemblies, components, and packaging as assigned.
- Develop and implement changes to product design and / or the manufacturing process to achieve efficiency, quality, and / or cost improvements by participating in new product development programs.
- Develop requirement specifications, system concepts, CAD generated using SolidWorks, detail drawings, BOMs and budgets. Make layouts of complex assemblies and details of parts of devices, mechanisms and structures.
- Provide customer product design engineering for economic production; may participate in meetings with customers.
- Assess proper material, tooling, automation and equipment selection.
- Work with manufacturing to trouble‑shoot problems, upgrades, retrofits, set‑ups, methods development, and the development of process parameters.
- Participate in product development meetings and may make recommendations to product design changes to enhance manufacturing and assembly.
- Conduct proof of concept experiments and design other testing requirements as needed.
- Develop SOPs, operations and maintenance manuals.
- Research new technology or development tools to remain informed of current technology.
- Understand Lean Six Sigma tools, projects and processes and incorporate these into assigned engineering projects.
- Review completed projects for accuracy, clarity and completeness.
- Ensure projects are compliant with all local, regional, and national regulatory requirements, codes and controls.
- Support all company safety and quality programs and initiatives.
- May perform other duties and responsibilities as assigned.
Required Skills And Experience
Experience with Photonic, Laser, and ASIC components and micro‑assembly.Experience in flip chip, chip on chip die attachment (on wafer), fiber attachment processes.5‑10 years of solid experience in related work.Excellent ability to solve technical, scientific and experimental problems.Excellent teamwork and communication skills.Required Education
Masters or PhD preferred in a related engineering discipline.Ottawa, Ontario, Canada CA$50,000.00-CA$140,000.00
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