Technical Fellow, Advanced Packaging Integration

Job Description

Job Description

OUR STORY

TechInsights is the information Platform for the semiconductor industry.

Regarded as the most trusted source of actionable, in-depth intelligence related to semiconductor innovation and surrounding markets, TechInsights’ content informs decision makers and professionals whose success depends on accurate knowledge of the semiconductor industry—past, present, or future.

Over 650 companies and 150,000 users access the TechInsights Platform, the world’s largest vertically integrated collection of unmatched reverse engineering, teardown, and market analysis in the semiconductor industry. This collection includes detailed circuit analysis, imagery, semiconductor process flows, device teardowns, illustrations, costing and pricing information, forecasts, market analysis, and expert commentary. TechInsights’ customers include the most successful technology companies who rely on TechInsights’ analysis to make informed business, design, and product decisions faster and with greater confidence. For more information, visit .

WHY WORK WITH US

• Company-sponsored training and development opportunities
• Comprehensive benefits package (health, dental, vision, wellness, RRSP / 401K Matching, annual fitness reimbursement)
• Flexible vacation policy
• Bring your own device program
• Community involvement opportunities through charitable alliances : -involvement
• Wellness resources and support
• Inclusive environment that prioritizes diversity, equity, and accessibility
• High-growth company driven by high performance
• Expected salary range : $175,000 - $195,000 CAD

THE OPPORTUNITY :

At TechInsights, we decode technology to reveal the innovations shaping our world. As the Technical Fellow, Advanced Packaging Integration, you’ll be a central figure in that mission, a recognized technical authority who bridges advanced packaging, processor architecture, and system-level performance.

This is a rare opportunity to shape the technical direction of two of TechInsights’ most dynamic product areas : Advanced Packaging and High Performance Computing. You will bring deep expertise in advanced packaging and interconnect innovation, from hybrid bonding to co-packaged optics (CPO) and extend that insight up the stack to processors, networking silicon, and full system integration.

Your leadership will help define how TechInsights connects device-level architecture to system-level performance, setting the foundation for next-generation compute analysis across the data center ecosystem.

WHAT YOU’LL DO

Lead with Technical Authority

2.5D / 3D integration, hybrid bonding, fan-out, glass core substrates, and embedded passives.

Own and Evolve Technology Roadmaps

Accelerate Content Creation through AI and Innovation

Engage Globally and Lead by Influence

WHAT YOU’LL BRING

Advanced packaging and assembly processes (TSVs, interposers, hybrid bonding, fan-out, glass core, embedded passives).

As part of the recruitment process for this position, you will be required to submit your latest citizenship and / or permanent residency information. This information will be used to comply with U.S. Export Control Laws and Regulations.

WORKING ARRANGEMENT

This role is on-site at our Ottawa office.

Technology knows no bounds, and neither does TechInsights. Bringing together talented humans from different perspectives, backgrounds and abilities is something we take seriously. We’re committed to building an inclusive environment that welcomes you to be your authentic self and allows us to push past the boundaries together.

TechInsights is committed to meeting the needs of people with disabilities. Accommodations are available on request for candidates taking part in all aspects of the selection process.

As part of any recruitment process, TechInsights collects and processes personal data relating to job applicants. We are committed to being transparent about how we collect and use that data and to meeting our data protection obligations. Our Privacy policy can be referenced here : -policy

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