Technical Fellow, Advanced Packaging & HPC Architect

A cutting-edge technology company is seeking a Technical Fellow specializing in Advanced Packaging and High Performance Computing in Ottawa, Ontario. This role involves serving as the subject matter expert, shaping technology roadmaps, and leveraging AI tools to enhance analysis. The ideal candidate should have over 10 years of experience in semiconductor packaging or processor design and be comfortable engaging with both engineers and executives. This position offers a comprehensive benefits package and a competitive salary range of $175,000 - $195,000 CAD.

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