Sr. Manager, Physical Design Engineering, Annapurna Labs

Annapurna Labs, designs custom silicon powering AWS’s cloud infrastructure. Custom SoCs live at the heart of Amazon ML servers — including Inferentia and Trainium Systems — delivering high-performance ML inference and training at cloud scale.

We’re looking for a Senior Manager, Physical Design Engineering to build and lead a world-class Physical Design team delivering multi-billion-transistor ML accelerator SoCs on latest tech nodes. This is a player-coach role: you will personally engage in the most critical technical decisions; chip-level floorplan architecture, multi-GHz timing convergence, high-speed I/O physical design, power delivery for KW class systems, and 2.5D / 3D integrations; while building a high-performing team and driving rigorous PPA targets, first-pass silicon success, and relentless continuous improvement.

Key job responsibilities
- Build, hire, and develop a physical design team of 10-15 engineers. Own headcount planning, performance management, career growth, and organizational scaling to support multiple concurrent tapeouts.

- Own the physical design strategy and execution roadmap across Inferentia, Trainium, and future products: implementation architecture, hierarchical methodology, PPA target-setting, and technology node adoption.

- Institutionalize continuous PPA improvement: benchmarking frameworks, regression tracking, design-quality dashboards, post-tapeout retrospectives, and structured improvement programs that compound across generations.

- Provide hands-on technical leadership on the hardest problems: multi-GHz timing closure, PDN architecture, high-speed I/O physical design, and 2.5D / 3D cross-die integration.

- Lead technology node enablement for 2nm and beyond: PDK evaluation, reference flow development, PPA pathfinding, and adoption recommendations.

- Define and deploy innovative RTL2GDS methodologies and CAD flows. Champion AI/ML-augmented design automation (RL-placement, ML-guided ECO, predictive analytics). Optimize cloud infrastructure for PD compute.

- Serve as part of senior technical interface with foundry partners and EDA vendors on tool roadmap, co-development, and technology co-optimization.

- Own tapeout execution: readiness reviews, foundry submittal, mask data coordination, and post-silicon yield learning. Drive cross-functional alignment with RTL, DFT, STA, Package, and Validation teams.

BASIC QUALIFICATIONS

- 5+ years people management leading PD teams of 8+ engineers, including hiring, performance management, and organizational growth.
- 10+ years hands-on ASIC/SoC physical design across multiple advanced nodes (7nm, 5nm, 3nm) with multiple successful tapeouts.
- Technical depth across full RTL-to-GDSII: floorplanning, CTS, routing, timing closure, PDN design, IR-drop/EM signoff, physical verification, and tapeout.
- Mastery of both EDA ecosystems: Synopsys (Fusion Compiler/ICC2, PrimeTime, StarRC, RedHawk-SC) AND Cadence (Innovus, Tempus, Quantus, Voltus). Physical verification with Siemens Calibre (DRC, LVS, PERC).
- Deep expertise in advanced STA (MMMC, POCV/AOCV, SSTA, PBA, IR-aware timing) and power integrity (static/dynamic IR-drop, EM, rush current, Ldi/dt, package-aware analysis).
- Proven expertise in high-speed PD (multi-GHz datapaths, SerDes, DDR5, HBM, PCIe Gen5+, UCIe) and low-power design (UPF, power gating, DVFS, retention).
- Experience with hierarchical methodologies for very large SoCs (>1B transistors). Expert scripting in TCL, Python, Perl.

PREFERRED QUALIFICATIONS

- Experience leading PD for AI/ML accelerators, GPUs, or high-performance data-center SoCs at leading semiconductor companies or hyperscalers.
- Direct 3nm GAA/Nanosheet experience; 2nm or sub-2nm engagement. Familiarity with CFET and backside power delivery (BSPDN).
- Quantifiable track record of continuous PPA improvement and metric-driven flow development across multiple projects and nodes.
- Strong program execution: managing concurrent tapeouts, milestone tracking, risk identification, and executive communication.
- Hands-on 2.5D/3D integration experience (CoWoS, EMIB, InFO, SoIC, Foveros) and chiplet strategy with UCIe.
- Track record deploying AI/ML-driven design methodologies in production flows.
- Experience with CPO, HBM4, silicon photonics, or CXL physical design.
- Multi-foundry technology assessment experience (TSMC, Samsung, Intel Foundry Services).
- Experience managing geographically distributed teams (U.S., Israel, global).
- Experience scaling PD organizations through 2x–3x growth. Patent portfolio or industry standards contributions (UCIe, IEEE).

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