Field Application Engineer – Smart Module
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This range is provided by Quectel. Your actual pay will be based on your skills and experience — talk with your recruiter to learn more.
Base pay range
CA$75,000.00 / yr - CA$100,000.00 / yr
Position Summary
We are seeking a Smart Module Field Application Engineer (FAE) to support North American customers with embedded smart module solutions, including Linux / Android-based platforms and AI-enabled edge devices. This is a hands‑on, customer‑facing role requiring close collaboration with sales, R&D, and ODM / JDM partners.
Key Responsibilities
- Provide pre‑sales and post‑sales technical support for Smart Module products
- Support system bring‑up, BSP integration, driver debugging, and peripheral integration
- Assist customers with system architecture design, performance optimisation, and feature implementation
- Support ODM / JDM projects, including hardware and software co‑debugging
- Assist with AI edge computing use cases (basic exposure acceptable)
- Coordinate with global R&D teams for issue escalation and resolution
- Support certification and compliance activities (FCC, EMC, PTCRB, carrier requirements)
- Travel to US customer sites as needed (~10%)
Required Qualifications
Bachelor’s degree or higher in Electrical Engineering, Computer Engineering, Computer Science, or related field3+ years of experience in embedded systems, FAE, or technical support rolesStrong experience with Linux-based embedded systemsFamiliarity with major SoC platforms (Qualcomm, NXP, Rockchip, MediaTek, or similar)Experience with system bring‑up, BSP, or driver‑level debuggingStrong problem‑solving and communication skillsFluent in English (written and spoken)Preferred Qualifications
Experience with Android / LinuxOS on embedded platformsExposure to AI / ML edge computingExperience supporting ODM / JDM or large‑scale customer projectsUnderstanding of certification and regulatory processesMandarin is a plusSeniority level : Mid‑Senior level
Employment type : Full‑time
Industry : Wireless Services and Telecommunications Carriers
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