Senior Packaging Engineer I - IC Package Innovation

A leading semiconductor company is seeking an Intermediate Package Development Engineer to oversee IC package development. The role involves co-designing package solutions, performing feasibility studies, and managing new packaging technologies. Candidates should have a degree in engineering and 5 years of relevant experience. The compensation package includes health benefits, a competitive salary range of $86,000 - $186,000, and opportunities for growth. Join a culture that values innovation and employee development.

#J-18808-Ljbffr