Senior Product Development / Mechanical Design Engineer - High Speed Connectors

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets. Amphenol Corporation is one of the world's largest designers and manufacturers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. ACS has an expansive global presence in research and development, manufacturing, and sales. We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment, and automotive.

Position: Senior Product Development / Mechanical Design Engineer – OSFP & High-Speed I/O Connectors

Location: Markham

New Position

Amphenol's High Speed IO Connectors and OverPass Solutions Business Unit is a market leader in high-speed, high-bandwidth interconnect solutions used in servers, storage, networking equipment, and data center infrastructure. Our products enable reliable, low-loss data transmission in some of the world's most advanced IT and Datacom platforms, helping power the technology behind leading Tier 1 OEMs. With global design, sales, and manufacturing teams, we are growing quickly and continuing to invest in our people and products. This role is a chance to make a real impact as part of a collaborative, fast-moving team within Amphenol's decentralized culture, where ideas are heard, initiative is encouraged, and teams are empowered to make decisions with clear accountability.

Position Overview

Amphenol is seeking a highly skilled and motivated Senior Product Development Engineer to lead the design and development of OSFP and other high-speed front-end I/O connectors. This role is pivotal in advancing connectivity solutions for next-generation AI/ML platforms and high-bandwidth data center applications. The engineer will serve as the technical owner of the OSFP form factor, driving innovation, customer engagement, and cross-functional execution.

Key Responsibilities

Design & Innovation

• Lead concept generation, design, and qualification of OSFP and other high-speed I/O connectors.
• Develop connectors optimized for AI/ML workloads with emphasis on signal integrity, mechanical robustness, and thermal efficiency.
• Apply advanced design techniques for low latency, high-density packaging, and manufacturability.
• Collaborate with cross-functional teams to ensure system-level integration and compliance with industry standards (e.g., OSFP, QSFP-DD, PCIe).

Testing & Validation

• Define and execute rigorous testing protocols for electrical, mechanical, and environmental performance.
• Perform Design FMEA, Tolerance Analysis, DFM, FEA (ANSYS preferred), and Risk Analysis.
• Work with internal labs and external partners to validate performance in real-world environments.

Project Management

• Manage development projects from concept through production, including timelines, deliverables, and cross-functional coordination.
• Maintain clear documentation and communication across engineering, manufacturing, and quality teams.
• Support NPI and transition to manufacturing.

Customer Engagement

• Act as the primary technical interface for OSFP-related customer engagements.
• Translate customer requirements into actionable design goals and provide support during design reviews, prototyping, and field validation.
• Present product concepts early in the development cycle and incorporate feedback into design iterations.

Qualifications

• Bachelor's or Master's degree in Mechanical or Electrical Engineering.
• 5+ years of experience in high-speed connector or high-speed product development. (MUST HAVE)
• Proficiency in CAD tools (SolidWorks, Creo) and simulation software (ANSYS).
• Strong understanding of signal integrity, EMI/EMC, and thermal management.
• Experience with materials and manufacturing processes including stamping, plating, molding, and assembly.
• Excellent communication skills with global teams and customers.
• Ability to manage multiple projects and prioritize effectively.

Why Work for Us?

• Benefits Coverage: Comprehensive health, dental, vision, and travel insurance.
• Health Care Spending Account: Additional financial support for health-related expenses.
• Pension Plan: Company-supported pension scheme.
• Incentive Plans: Progressive employee incentive plans.
• Talent Development: Opportunities for professional growth and development.
• Company Recreation Club: Participate in fun activities, draws with exciting prizes, summer BBQs, holiday parties, and more!

The base salary range for this position $105,000 - $140,000 annually. In determining the rate of pay, Amphenol considers a variety of nondiscriminatory factors, including but not limited to geographic location, relevant industry experience, qualifications, skills, and education. It would be rare for an individual to be hired at or near the top of the range for a given role. Base salary is one facet of Amphenol's total rewards package which includes participation in our comprehensive benefits program with medical, dental, and vision benefits, vacation, sick leave, paid holidays, life insurance, short/long term disability, and membership in our Defined Contribution Pension Plan.

Amphenol Corporation is proud of our reputation as an excellent employer. Our main focus is to provide the highest level of support and responsiveness to both our employees and our customers. Amphenol Corporation offers the opportunity for career growth within a global organization. We believe that Amphenol Corporation is unique in that every employee, regardless of his or her position, has the ability to positively impact the business.

Amphenol Canada is committed to developing inclusive, barrier-free selection processes and work environments. If contacted in relation to a job opportunity, you should advise Amphenol, in a timely fashion, of the accommodation measures which must be taken to enable you to be assessed in a fair and equitable manner. Information received relating to accommodation measures will be addressed confidentially.