Signal Integrity Engineer

WHAT YOU DO AT AMD CHANGES EVERYTHING

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.Together, we advance your career.

The Role

The Centralized Signal Integrity/Power Integrity (SI/PI) Engineering team supports the electrical performance and cost objectives of AMD products through the integration of silicon, package, and platform electrical design. The team works closely with engineering partners across the organization to support both current products and forward‑looking technology development and feasibility studies.

The Person

As a member of the Centralized Signal Integrity/Power Integrity team, you will collaborate with cross‑functional engineering teams and stakeholders to support sound engineering decisions and effective problem solving. You are comfortable working both independently and collaboratively, value clear technical communication, and are motivated to contribute to innovative, high‑performance products.

Key Responsibilities

• Design, model, simulate, and characterize high‑speed signal propagation and power delivery networks for AMD products
• Build system‑level channel simulations to help ensure package and PCB designs meet defined SI/PI specifications
• Review package and PCB layouts and identify opportunities for refinement and improvement
• Work with vendors to obtain packages, PCB, and socket models, including standardized models when available, and use them in simulations
• Run channel simulations to generate performance data and evaluate results against specifications
• Contribute to the development of next‑generation signal and power integrity technologies, including capabilities supporting emerging AI applications

Preferred Experience

• Knowledge of signal integrity and power integrity fundamentals, with experience modeling or analyzing complex structures such as packages and PCBs
• Experience working with PCB, package, or IC‑level power delivery networks
• Exposure to silicon packaging and PCB design principles related to signal and power integrity
• Experience with high‑speed digital interfaces such as PCIe, DDR/LPDDR, HDMI, USB, or similar technologies
• Experience with electrical modeling, EDA, or AMS tools (for example, HFSS, SIwave, HSPICE, or comparable tools)
• Understanding of electromagnetic theory and circuit analysis
• Familiarity with engineering computing or scripting languages such as Python, MATLAB, or similar
• Ability to communicate technical ideas and results clearly through documentation, data, and collaboration
• Ability to work independently while collaborating effectively with diverse, cross‑functional teams

Academic Credentials

• Bachelor’s or master’s degree in electrical engineering, Computer Engineering, or a related field or equivalent practical experience

This role is not eligible for visa sponsorship.

#LI-DP1

#LI-HYBRID

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

The Role

The Centralized Signal Integrity/Power Integrity (SI/PI) Engineering team supports the electrical performance and cost objectives of AMD products through the integration of silicon, package, and platform electrical design. The team works closely with engineering partners across the organization to support both current products and forward‑looking technology development and feasibility studies.

The Person

As a member of the Centralized Signal Integrity/Power Integrity team, you will collaborate with cross‑functional engineering teams and stakeholders to support sound engineering decisions and effective problem solving. You are comfortable working both independently and collaboratively, value clear technical communication, and are motivated to contribute to innovative, high‑performance products.

Key Responsibilities

• Design, model, simulate, and characterize high‑speed signal propagation and power delivery networks for AMD products
• Build system‑level channel simulations to help ensure package and PCB designs meet defined SI/PI specifications
• Review package and PCB layouts and identify opportunities for refinement and improvement
• Work with vendors to obtain packages, PCB, and socket models, including standardized models when available, and use them in simulations
• Run channel simulations to generate performance data and evaluate results against specifications
• Contribute to the development of next‑generation signal and power integrity technologies, including capabilities supporting emerging AI applications

Preferred Experience

• Knowledge of signal integrity and power integrity fundamentals, with experience modeling or analyzing complex structures such as packages and PCBs
• Experience working with PCB, package, or IC‑level power delivery networks
• Exposure to silicon packaging and PCB design principles related to signal and power integrity
• Experience with high‑speed digital interfaces such as PCIe, DDR/LPDDR, HDMI, USB, or similar technologies
• Experience with electrical modeling, EDA, or AMS tools (for example, HFSS, SIwave, HSPICE, or comparable tools)
• Understanding of electromagnetic theory and circuit analysis
• Familiarity with engineering computing or scripting languages such as Python, MATLAB, or similar
• Ability to communicate technical ideas and results clearly through documentation, data, and collaboration
• Ability to work independently while collaborating effectively with diverse, cross‑functional teams

Academic Credentials

• Bachelor’s or master’s degree in electrical engineering, Computer Engineering, or a related field or equivalent practical experience

This role is not eligible for visa sponsorship.

#LI-DP1

#LI-HYBRID

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.