Process control engineer Jobs in Ottawa, ON

Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq : SANM), responsible for RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and testing, process development, assembly and test innovation, to volume manufacturing. We are extremely proud to partner with our customers enabling their product through the full product lifecycle.

At AMT, you will work on some of the most innovative programs and products that address emerging markets, including optical and RF communication, datacenter connectivity, quantum computing, automotive sensing systems, medical devices and diagnostics and test & measurement systems, to name a few.

Come and join us, and be part of a team that challenges you to be your best, where you will be empowered to make a difference and where we are extremely proud of what we deliver, together.

Job Purpose

The Microelectronics Process Engineer will manage, develop and implement new processes to be used in our manufacturing environment - embracing advanced RF, optical and microelectronic components, modules and sub-systems.

Nature of Duties / Responsibilities

• Work directly with RF, optical and microelectronic product design and development teams to provide process engineering solutions in support of new product development, with subsequent NPI and manufacturing support.
• Wafer level assembly experience would be an asset for this position.
• Strong project / customer management skills required.
• Supports new technology research and development pertaining to optical and microelectronic process solutions.
• Manages projects and timelines in order to meet milestones and deliverables of various customer projects.
• Application program on high end automated assembly equipment (dispensers, die bonders, wirebonders, optical aligners, etc.).
• Develops processes related to the assembly of Optical and Microelectronic modules, such as :
• SMT + flip chip assembly (multi chip modules)
• Flip chip underfill
• Epoxy dispensing, high accuracy die bonding
• Semiconductor die and microelectronic components bonding and interconnection (wirebond)
• Packaging encapsulation
• Optical active / passive alignment
• Troubleshoots and analyzes process performance problems. Provides technical guidance to less experienced team members.
• Conducts research into complex engineering problems to develop new operating policies, capabilities, and processes.
• Assists the Process Engineering team to deliver on accountabilities. Takes ownership for processes under his / her control.
• Creates process assembly documentation.
• Tooling and fixture design and procurement.
• Performs qualification on new processes being introduced.
• Implements and suggests engineering changes.
• Researches, procures, and accepts new pieces of equipment for continuously evolving technologies.
• Supports customer NPI builds within tight timelines.
• Provides DFx type feedback to the internal design team as well as external customers to help optimize manufacturability of products as well as increase yields and throughput.

Education & Experience

Sanmina welcomes and encourages applications from persons with disabilities. In accordance with the guidelines established under the Accessibility for Ontarians with Disabilities Act (AODA), accommodations are available on request for candidates taking part in all aspects of the selection process.

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