ASIC Physical Design Engineer: DSP Core Tapeout

Qualcomm Canada ULC in Markham, Ontario is seeking a Physical Design Engineer to contribute to DSP cores used in next‑generation mobile, compute, and AI products. In this role, you will gain hands‑on exposure to the complete ASIC development cycle, from RTL handoff through physical implementation and tapeout.

This position is ideal for early‑career engineers with a strong foundation in VLSI and digital design fundamentals who are passionate about semiconductor technology and eager to build

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