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Microelectronic Packaging Design Engineer - End-to-EndGlobal Talent Alliance, Canada • Ottawa, ON, Canada
Microelectronic Packaging Design Engineer - End-to-End

Microelectronic Packaging Design Engineer - End-to-End

Global Talent Alliance, Canada • Ottawa, ON, Canada
30+ days ago
Job type
  • Full-time
Job description
A leading engineering services provider in Ottawa is seeking a Microelectronic Packaging Design Engineer. This role involves defining technologies and designs for microelectronic modules, ensuring compliance, and generating product documentation. The ideal candidate has at least 5 years of experience in electronic hardware design, particularly in Wafer Level and Chip Scale Packaging. Proficiency in CAD software is essential. Strong communication skills and customer focus are highly valued. #J-18808-Ljbffr
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Microelectronic Packaging Design Engineer - End-to-End • Ottawa, ON, Canada

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