Job descriptionIntel desires entry into market segments served by high performance discrete graphics. Participation in such market segments requires the delivery of reference platforms to downstream customers with sufficient confidence to ramp the design, or a very close derivative, into high volume production quickly. Intel is building this capability and now seeks to expand its GPU Platform Engineering team. We are responsible for delivering leading GPU solutions across market segments, and will continue to deliver a pipeline of innovation to support the complete Intel platform, including CPU, memory, and accelerators. Responsibilities
Architect, simulate, and validate thermal management and fan control features for Intel dGPU products. Design and optimize high performance thermal solutions and overall platform designs for Intel dGPU cards and systems. Utilize knowledge to influence upstream, internal, and external teams (firmware, software, driver, etc.) to ensure the product meets thermal and acoustic requirements. Be aware of typical industry thermal mechanical technologies and concerns; explore new technologies to push the envelope and become an industry leader in thermal performance. Document work and communicate with design partners or high‑level management. Collaborate with engineers across system engineering disciplines (mechanical, PCB layout, board design, power design, etc.) and with program management and other teams to meet technical and schedule requirements. Work with key OEM/ODM partners or customers to support their designs. Behavioral Traits
Well organized, with good written and oral communication skills. Passionate about innovation and end‑to‑end ownership. Comfortable with change and change management, and able to collaborate with sites worldwide. Detail oriented and able to express technical ideas clearly in writing or by presentation. Minimum Qualifications
Bachelor of Science degree in Mechanical Engineering. 3+ years of experience applying the fundamentals of heat transfer and fluid dynamics. 3+ years of experience with thermal debug/analysis. Preferred Qualifications
3+ years of experience with heat sink fundamentals in the PC ecosystem. 3+ years of experience testing high performance thermal mechanical solutions for electronics applications (air‑cooled and/or liquid‑cooled). 2+ years of experience evaluating trade‑offs between thermal and other design parameters (mechanical, electrical, etc.). 2+ years of experience with thermal management and fan control testing/debugging. 1+ year of experience with thermal simulation software such as Icepak or Flotherm. 2+ years of experience working with PCIe, OAM, or other desktop or server form factors. 2+ years of experience in 3D modelling with software such as Creo/ProE or SolidWorks. Annual Salary Range for jobs which could be performed in Canada: CAD 109,380.00 – 154,420.00 (salary range dependent on location and experience). Job Type: Experienced Hire Shift: Shift 1 (Canada) Primary Location: Virtual Canada Work Model: This role is available as a fully home‑based position and generally would require you to attend Intel sites only occasionally based on business need. You must live and work from the country specified in the job posting where Intel has a legal presence. Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
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