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Microelectronic Packaging Design Engineer
Microelectronic Packaging Design EngineerSanmina • Ottawa, ON, CA
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Microelectronic Packaging Design Engineer

Microelectronic Packaging Design Engineer

Sanmina • Ottawa, ON, CA
Il y a plus de 30 jours
Type de contrat
  • Temps plein
Description de poste

Microelectronic Packaging Design Engineer

Join Sanmina's Advanced Microsystems Technologies (AMT) as a Microelectronic Packaging Design Engineer. This role supports technology and product development programs across the full product lifecycle, from initial selection and concept definition through detailed design, prototyping, qualification, and volume manufacturing.

Job Description

Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq : SANM), responsible for RF, Microelectronic, Optical components and Integrated Subsystems. AMT delivers services from design concept, through prototype design and testing, process development, assembly and test innovation, to volume manufacturing.

Job Purpose

The Microelectronic Design Engineering team, as part of Sanmina’s Global Design Engineering Team, represents a key strategic growth area of the total engineering service offering. The team provides engineering and design services in microelectronic, optical and semiconductor packaging and component design, supported through its background in materials technology, thermal, structural and reliability engineering.

Nature Of Duties / Responsibilities

  • Select microelectronic technologies and define design concepts based on product applications, requirements and specifications.
  • Design microelectronic packages & modules, including material selection, substrate layout, mechanical, thermal, reliability, electrical (RF), optical, test and process engineering for volume manufacturing.
  • Contribute to design and engineering activities as part of a multidisciplinary product development team in line with customer requirements and specifications.
  • Generate product documentation : design specifications, drawings (parts, assemblies, processes), Bill of Materials, and documentation release via engineering change orders.
  • Define specifications / requirements and coordinate with manufacturers / suppliers for outsourced custom components.
  • Perform and support engineering product verification to ensure compliance to product requirements.
  • Support business development initiatives by interfacing with potential and existing customers, preparing marketing materials, proposals and quotations.
  • Support turnkey product development through manufacturing implementation.

Education And Experience

  • Bachelor’s Degree in Mechanical Engineering, Physics, Material Science, or related field with experience in electronic hardware design and packaging (multi‑chip modules, semiconductor packaging for RF / Microwave / Optical applications).
  • Minimum of 8 years of relevant experience.
  • Proficiency with packaging and substrate design software (Cadence Allegro Package Designer Plus).
  • Background or experience in microelectronic technologies, materials, components and manufacturing methods.
  • Experience with end‑to‑end product development and manufacturing implementation.
  • Familiarity with commercial FEA tools and supporting analysis.
  • Security clearance is an asset.
  • Strong customer delivery focus, excellent communication skills, and ability to work well within a multidisciplinary team in a fast‑paced environment.
  • Seniority Level

    Mid‑Senior level

    Employment Type

    Full‑time

    Job Function

    Information Technology

    Industries

    Appliances, Electrical, and Electronics Manufacturing

    Accessibility

    Sanmina welcomes and encourages applications from persons with disabilities. Accommodations are available on request for candidates taking part in all aspects of the selection process.

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